{"error":0,"goodid":"84799032","time":"10811","good_data":{"id":"84799032","name":"\u534a\u5c0e\u9ad4\u69cb\u88dd\u7528\u4e4b\u9ecf\u6676\u6a5f\u3001\u5168\u81ea\u52d5\u6372\u5e36\u5f0f\u69cb\u88dd\u6a5f\u53ca\u92b2\u7dda\u6a5f\u4e4b\u96f6\u4ef6","ename":"Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors","api_link":"http:\/\/portal-api.g0v.ronny.tw\/api\/goodid\/84799032"},"data":[]}